Chapter Technical Meeting Archives |
|
June 14, 2011 "The Future of Emerging Technologies within the Utility Power Grid" Fouad E. Dagher The National Grid Corporation Mar. 29, 2011 "Chemically Vapor Deposited Polymer Coatings for Non-Hermetic Packaging of Microelectronics" Aleksandr White, Senior Engineer GVD Corporation Feb. 15, 2011 An "Open House" Hosted By Mitutoyo America "Non-Contact Metrology Instruments for the Semiconductor Industry" Michael Creney, Regional Manager Mitutoyo America Dec. 2, 2010 Joint Meeting with IEEE-CPMT, IEEE-SSCS "Wire Bonding: Processes and Materials" Lee Levine, Consultant Process Solutions Consulting, New Tripoli, PA Oct. 26, 2010 "Ceramic Packaging in Medical Applications" Arne Knudsen, Ph.D., General Manager Kyocera America Sept. 28, 2010 "Thermal Evaluation of Materials for LEDs" Adam M. Scotch, Ph.D., Principal Scientist OSRAM SYLVANIA |
| June 22, 2010 "Solar Cell Manufacturing of Mono-crystalline Wafers with IPA Free Texturing" Matt Moynihan - R&D Director, Dow Electronic Materials |
| March 24, 2010 - Joint Chapter Meeting with ACerS - Two Presentations: "An Insider's Guide to Understanding and Obtaining Patents and Managing Costs" - Robert J. Sayre "Patent Prosecution Strategies in a Changing Legal Environment" - Joseph B. Milstein, Ph.D., P.E., Esq. |
| February 23, 2010 "Solders in LED Packaging" Presented by Mario Scalzo Senior Technical Support Engineer - Dartmouth 6σ Black Belt of Indium Corporation, Clinton NY |
| January 19, 2010 "Stories From The Trenches: How a Circuit Board Guy Entered the Solar Cell Industry" Don Cullen of MacDermid Waterbury CT |
November 17, 2009 "Copper Cold Spray Thermal Management and Solderable Surfaces" Mr. Victor Champagne ARL |
| October 6, 2009 "Material Trade-offs in Designing Ceramic Packages" Dr. Arne Knudsen, Kyocera |
| June 16, 2009 "Advanced Lithium-Ion Battery Applications & Materials Considerations" Bill Yalen, Program Manager / Lead Program Engineer, Yardney, Inc. |
| March 31 2009 "The Geometric Nature of Surface Roughness and Losses with the Skin Effect" Christopher A. Brown, PhD, PE |
| February 11, 2009 "String Ribbon Wafer Process Technology" Minh Le, Manager of Technical Staff, Evergreen Solar Corporation |
| January 20, 2009 Fuel Cells: State of the Art and Challenges for Clean and Efficient Power Generation Prof. Uday Pal Boston |
December 5, 2008 Chapter Holiday Meeting: Our World in 2020: What the Next Decade Will Bring? John Roman - RJR Polymers |
| October 21, 2008 "Thermal Interface Materials for IC Cooling - Design, Applications and Trends" Dr. Percy Chinoy - Chomerics |
| September 9, 2008 SMTA/IMAPS NE Joint Meeting and Plant Tour Rochester Electronics Newburyport, Massachusetts |
Copyright 2010 iMAPS New England Chapter
|


iMAPS New England Chapter |
International Microelectronics And Packaging Society |