Chapter Technical Meeting Archives

June 14, 2011
"The Future of Emerging Technologies within the Utility Power Grid"
Fouad E. Dagher
The National Grid Corporation

Mar. 29, 2011
"Chemically Vapor Deposited Polymer Coatings for Non-Hermetic Packaging of Microelectronics"
Aleksandr White, Senior Engineer
GVD Corporation

Feb. 15, 2011
An "Open House" Hosted By Mitutoyo America
"Non-Contact Metrology Instruments for the Semiconductor Industry"
Michael Creney, Regional Manager
Mitutoyo America


Dec. 2, 2010
Joint Meeting with IEEE-CPMT, IEEE-SSCS
"Wire Bonding: Processes and Materials"
Lee Levine, Consultant
Process Solutions Consulting, New Tripoli, PA

Oct. 26, 2010
"Ceramic Packaging in Medical Applications"
Arne Knudsen, Ph.D., General Manager
Kyocera America

Sept. 28, 2010
"Thermal Evaluation of Materials for LEDs"
Adam M. Scotch, Ph.D., Principal Scientist
OSRAM SYLVANIA
June 22, 2010
"Solar Cell Manufacturing of Mono-crystalline Wafers with IPA Free Texturing"
Matt Moynihan - R&D Director, Dow Electronic Materials
March 24, 2010 - Joint Chapter Meeting with ACerS - Two Presentations:
"An Insider's Guide to Understanding and Obtaining Patents and Managing Costs" - Robert J. Sayre
"Patent Prosecution Strategies in a Changing Legal Environment" -  Joseph B. Milstein, Ph.D., P.E., Esq.
February 23, 2010
"Solders in LED Packaging"
Presented by  Mario Scalzo Senior Technical Support Engineer - Dartmouth 6σ Black Belt of  Indium Corporation, Clinton NY
January 19, 2010
"Stories From The Trenches: How a Circuit Board Guy Entered the Solar Cell Industry"
Don Cullen of MacDermid Waterbury CT

November 17, 2009
"Copper Cold Spray  Thermal Management and Solderable Surfaces"
Mr. Victor Champagne ARL
October 6, 2009
"Material Trade-offs in Designing Ceramic Packages"
Dr. Arne Knudsen, Kyocera
June 16, 2009
"Advanced Lithium-Ion Battery Applications & Materials Considerations"
Bill Yalen, Program Manager / Lead Program Engineer, Yardney, Inc.
March 31 2009
"The Geometric Nature of Surface Roughness and Losses with the Skin Effect"
Christopher A. Brown, PhD, PE
February 11, 2009
"String Ribbon Wafer Process Technology"
Minh Le, Manager of Technical Staff, Evergreen Solar Corporation
January 20, 2009
Fuel Cells: State of the Art and Challenges for Clean and Efficient Power Generation
Prof. Uday Pal Boston

December 5, 2008
Chapter Holiday Meeting: Our World in 2020: What the Next Decade Will Bring?
John Roman - RJR Polymers
October 21, 2008
"Thermal Interface Materials for IC Cooling - Design, Applications and Trends"
Dr. Percy Chinoy - Chomerics
September 9, 2008
Copyright 2010 iMAPS New England Chapter
iMAPS New England Chapter
International Microelectronics And Packaging Society