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iMAPS New England ChapterChapter Technical Meeting |
Tuesday February 23rd 2010
Solders in LED Packaging
presented by
Mario Scalzo
Senior Technical Support Engineer - Dartmouth 6σ Black Belt
Indium Corporation, Clinton NY
ABSTRACT Successful
LED
packaging is achieved through a dependable method of attachment.
Various methods / materials exist, and possess their own
characteristics. The demand for a more robust and brighter LED
presents a set of challenges that will need to be addressed. In these
cases, a metallic solution offers the attributes required for a
successful bond.
This presentation will highlight the different product types, associated alloys and process improvements that contribute to this application. One such improvement is a low oxide method of manufacturing Gold-Tin (AuSn) preforms. AuSn is used in high power die attach applications. Other applications and materials to be discussed are: NanoFoil® used in NanoBonding®, Solder paste printing suggestions, Compressible Metal TIMs or Heat-Springs® used in heat sinking LED packages to a cooling solution. In addition it will cover the different pack methods which can be used for HVM manufacturing. A presentation and hand outs will be provided for public use.
This presentation will highlight the different product types, associated alloys and process improvements that contribute to this application. One such improvement is a low oxide method of manufacturing Gold-Tin (AuSn) preforms. AuSn is used in high power die attach applications. Other applications and materials to be discussed are: NanoFoil® used in NanoBonding®, Solder paste printing suggestions, Compressible Metal TIMs or Heat-Springs® used in heat sinking LED packages to a cooling solution. In addition it will cover the different pack methods which can be used for HVM manufacturing. A presentation and hand outs will be provided for public use.
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