iMAPS New England
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2009 - 2010
Chapter Meeting Technical Chair
 Guixiang Yang

Technical Symposium Technical  Chair
Dr Wei Han

Call for Papers

Chapter Technical Meeting Archives
Event
"Solar Cell Manufacturing of Mono-crystalline Wafers with IPA Free Texturing"
Matt Moynihan - R&D Director, Dow Electronic Materials
Joint Chapter Meeting with ACerS - Two Presentations
"An Insider's Guide to Understanding and Obtaining Patents and Managing Costs" - Robert J. Sayre and "Patent Prosecution Strategies in a Changing Legal Environment" -  Joseph B. Milstein, Ph.D., P.E., Esq.
Solders in LED Packaging
presented by  Mario Scalzo Senior Technical Support Engineer - Dartmouth 6σ Black Belt of  Indium Corporation, Clinton NY

"Stories From The Trenches:
How a Circuit Board Guy Entered the Solar Cell Industry"

Don Cullen of MacDermid Waterbury CT
"Copper Cold Spray  Thermal Management and Solderable Surfaces"
Mr. Victor Champagne ARL
"Material Trade-offs in Designing Ceramic Packages" - Dr. Arne Knudsen, Kyocera
"Advanced Lithium-Ion Battery Applications & Materials Considerations" Bill Yalen Program Manager / Lead Program Engineer Yardney, Inc.
2009 Symposium & Expo

"The Geometric Nature of Surface Roughness and Losses with the Skin Effect"

Christopher A. Brown, PhD, PE
"String Ribbon Wafer Process Technology"
Fuel Cells: State of the Art and Challenges for Clean and Efficient Power Generation
Prof. Uday Pal Boston
Chapter Holiday Meeting:
Our World in 2020: What the Next Decade Will Bring?- John Roman - RJR Polymers
Thermal Interface Materials for IC Cooling - Design, Applications and Trends - Dr. Percy Chinoy - Chomerics