PDF of Presentation
Pictures
ABSTRACT: Thermal
interface materials are a key enabler for efficient
removal of heat from ICs to a heat spreader or heat sink. A number of
thermal, mechanical, electrical design variables impact the material
selection from among the wide spectrum of available thermal interface
materials. The interfacial contact resistance is a critical factor in
minimizing the overall thermal impedance. Real-world applications
will be presented to illustrate the concepts. Technology and market
trends that drive the development of thermal interface materials will
be discussed.
PDF of Presentation
BIOGRAPHY:
Percy Chinoy is New Business Development Manager at
Chomerics. He leads the Marketing and R&D efforts of Chomerics
Thermal Business globally. Percy has been with Chomerics for two and
half years. Prior to Chomerics, Percy had 15 years experience in
business development, technology development and consulting in
various segments of the electronics industry. He previously worked
as Global Business Manager at Rohm and Haas Electronic Materials,
Management Consultant at PRTM, and Principal Engineer at M/A-COM.
Percy has a Ph.D. in Chemical/Electrical Engineering from Rensselaer
Polytechnic Institute and an MBA from Boston College.
COMPANY PROFILE:
Chomerics (Woburn MA) division of Parker Hannifin
Corporation is a global leader in the development and application of
electrically and thermally conductive materials for electronics
systems. Chomerics offers a wide range of EMI shielding, thermal
management, optical, and engineered plastic solutions for
telecommunications, information technology, consumer, automotive,
military, industrial and medical electronics markets. For details,
visit www.parker.com/chomerics.
